Semiconductor package heat spreaders and fabrication methods therefor

ABSTRACT

A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.

TECHNICAL FIELD

The present invention relates generally to semiconductor heatdissipation, and more particularly to semiconductor package heatspreaders and methods for the fabrication thereof.

BACKGROUND ART

In the electronics industry, a continuing objective is to further andfurther reduce the size of electronic devices while simultaneouslyincreasing performance and speed. Cellular telephones, personal datadevices, notebook computers, camcorders, and digital cameras are but afew of the consumer products that require and benefit from this ongoingminiaturization of sophisticated electronics.

Integrated circuit (“IC”) assemblies for such complex electronic systemstypically have a large number of interconnected IC chips. The IC chipsare usually made from a semiconductor material such as silicon orgallium arsenide. Photolithographic techniques are used to form thevarious semiconductor devices in multiple layers on the IC chips.

After manufacture, the IC chips are typically incorporated into packagesthat may contain one or several such chips. The semiconductor devicechip is mounted on the surface of a substrate, for example by means of alayer of epoxy. Gold bond wires can connect electrical contact points onthe upper surface of the device to the substrate. Contact balls can alsobe provided on the lower surface of the device for additionalconnections between the device and the substrate. A molding compound isused to encapsulate the die and the bond wires, providing environmentalprotection for the die and defining the semiconductor chip package.These chip packages or modules are then typically mounted on printedcircuit wiring boards.

In conventional multi-chip modules, a number of semiconductor devicesare mounted in close proximity within a single package. This eliminatesseparate packages for each of the semiconductor devices, improveselectrical performance, and reduces the overall board space occupied bythe devices.

Due to the increase in the packing density, however, the power density(the heat output concentration) of such a multi-chip module is typicallyhigher than when the chips are separately packaged. This requires moreelaborate designs for thermal management to keep the device temperatureswithin acceptable ranges.

In conventional multi-chip modules, the devices are connected to asubstrate, and electrical connections among the devices are accomplishedwithin the substrate. One of the technologies used to connect thedevices to the substrate is called “flip chip” or face down bonding, andemploys the well-known controlled collapse chip connection (or “C4”)bonding technology. With this technology, solder bumps are first formedat the chip terminals. Subsequently, the semiconductor devices areflipped over onto the substrate and the solder bumps are melted toconnect to corresponding terminal pads on the substrate.

Heat management through such a structure can be critical. The internalthermal resistance and thermal performance of the flip chip interconnecttechnology are determined by a series of heat flow paths. By making highheat conductivity connections between the bottom of the die and thesubstrate, heat generated in the die can be transferred efficiently fromthe die to the substrate.

For applications where additional heat must be removed from thesemiconductor die, the molding compound that encapsulates the die can bepartially omitted from the upper surface of the die to partially exposethis surface. The exposed die surface can then be put in direct physicalcontact with a heat spreader that overlies the semiconductor die. Toenhance the cooling performance, a layer of thermal grease or the likecan be spread between the die surface and the heat spreader to improveheat transfer to the heat spreader.

The heat spreader is typically formed so that it can also be attached tothe underlying substrate, resulting in a mechanically strong package.Where necessary, the heat spreader can also be encapsulated in a moldingcompound that is formed overlying the upper surface of the package.

The heat thus flows first from the semiconductor device to the body ofthe semiconductor module or package into which it has been incorporated,and then to the package surface and to the heat spreader that isattached to the package surface. Unfortunately, there are drawbacksassociated with the use of known heat spreaders for flip chip and othersemiconductor packages. Among these drawbacks are heat spreadermanufacturing costs, complicated assembly processes, and concerns aboutpackage reliability. These drawbacks can be understood, for example, byconsidering common prior art two-piece and single-piece structures.

One such heat spreader structure is a two-piece configuration having astiffener with a hollow core that surrounds the flip chip, and a metallid cover that is on top of the stiffener and the flip chip. Often, thestiffener is thicker than the metal lid. Two different metal formingprocesses are then required to fabricate the two different pieces of theheat spreader from two different raw metal sheets of two differentthicknesses. Furthermore, assembly of a two-piece heat spreader isexpensive and complicated since two layers of adhesive must beseparately and carefully applied: one between the substrate and thestiffener, and a second between the stiffener and the metal lid.

In another prior art heat spreader structure, a hollow cavity and a lidare formed as a single piece. To form the cavity therein for the chip, arather thick metal sheet needs to be used, and a substantial amount ofmaterial then needs to be removed to form the chip cavity. Thus, costlymetal forming processes, like milling or casting, have to be employed tofabricate this type of heat spreader.

Consequently, there still remains a need for improved, more economical,more efficient, and more readily manufactured and assembled heatspreaders, heat spreader packages, and fabrication methods for use withflip chip semiconductor devices.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method for fabricating a semiconductorheat spreader from a unitary metallic plate. The unitary metallic plateis formed into a panel, channel walls, at least two feet, and at leastone external reversing bend. The channel walls depend from the panel todefine a channel between the channel walls and the panel for receiving asemiconductor therein. The feet extend from respective channel walls forattachment to a substrate.

Certain embodiments of the invention have other advantages in additionto or in place of those mentioned above. The advantages will becomeapparent to those skilled in the art from a reading of the followingdetailed description when taken with reference to the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 (PRIOR ART) is a figurative side view of a prior art heatspreader containing a semiconductor package;

FIG. 2 is a view of a heat spreader in accordance with the presentinvention;

FIG. 3 is a depiction of the application of adhesive by line dispensingonto a substrate;

FIG. 4 is a fragmentary end view of the heat spreader of FIG. 2 attachedto a substrate;

FIG. 5 is a view of an auxiliary heat spreader formed to fit over theheat spreader of FIG. 2;

FIG. 6 is a view of a heat spreader having stand-off feet;

FIG. 7 is a view of a heat spreader having toed feet;

FIG. 8 is a view of a heat spreader having stand-off toed feet;

FIG. 9 is a view of a heat spreader having slotted flat feet;

FIG. 10 is a partial cross-sectional view of the heat spreader shown inFIG. 9;

FIG. 11 is a view of a heat spreader having a depressed panel in thecenter thereof;

FIG. 12 is a view of a heat spreader having slotted stand-off feet;

FIG. 13 is a view of a heat spreader having an integral auxiliary heatspreader formed across the top thereof;

FIG. 14 is a view of a heat spreader having stand-off feet with sideledges;

FIG. 15 is a view of a heat spreader having zigzag feet;

FIG. 16 is a view of a heat spreader having box feet;

FIG. 17 is a cross-sectional view, taken generally on line 17-17 in FIG.16, of the heat spreader and the clip-attach auxiliary heat spreader ofFIG. 16 in a snapped or clipped together configuration;

FIG. 18 is a view of a heat spreader with a panel having edges formedinto clip bosses;

FIG. 19 is a view of a heat spreader with a panel flanked by box feet;

FIG. 20 is a top view of the heat spreader of FIG. 14;

FIG. 21 is a top view of a heat spreader, similar to the heat spreaderof FIG. 20, with notches on the ends of the panel;

FIG. 22 is a top view of a heat spreader, similar to the heat spreaderof FIG. 20, with slots in the side ledges thereof;

FIG. 23 is a top view of a heat spreader having a circular rather thanlinear configuration for the stand-off feet;

FIG. 24 is a top view of a heat spreader similar to the heat spreaderillustrated in FIG. 23, but including notches therein;

FIG. 25 is a top view of a heat spreader similar to the heat spreaderillustrated in FIG. 24, but including slots therein;

FIG. 26 is an enlarged top view of the heat spreader shown in FIG. 24;

FIG. 27 is a cross-sectional view of the heat spreader shown in FIG. 26,taken on line 27-27 therein;

FIG. 28 is an isometric view of the heat spreader shown in FIGS. 26 and27, including an auxiliary heat spreader thereabove; and

FIG. 29 is a flow chart of a method for fabricating a semiconductor heatspreader in accordance with the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known system configurations and process steps are not disclosed indetail.

Likewise, the drawings showing embodiments of the apparatus aresemi-diagrammatic and not to scale and, particularly, some of thedimensions are for the clarity of presentation and are shown exaggeratedin the FIGs. Also, where multiple embodiments are disclosed anddescribed having some features in common, for clarity and ease ofillustration and description thereof like features one to another willordinarily be described with like reference numerals.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional plane or surface of the semiconductor heat spreader,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “on”,“above”, “below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”,“lower”, “over”, and “under”, are defined with respect to the horizontalplane.

Referring now to FIG. 1 (PRIOR ART), therein is shown a somewhatfigurative side view of a prior art two-piece heat spreader 100. Asemiconductor package 102 is attached by an adhesive layer 104 to asubstrate 106. The semiconductor package 102 is located within an opencore 108 of a hollow core stiffener 110. The hollow core stiffener 110is also attached, by an adhesive layer 112, to the substrate 106. A heatspreader plate 114 that is separate from the hollow core stiffener 110is located above the hollow core stiffener 110 and the semiconductorpackage 102. The heat spreader plate 114 is attached to the hollow corestiffener 110 by an adhesive layer 116.

A thermal interface material layer 118 contacts and is located betweenthe semiconductor package 102 and the heat spreader plate 114. Aconventional ball grid array (“BGA”) 120 of minute solder balls isdisposed on the opposite attachment surface of the substrate 106 forattaching and electrically connecting the substrate 106 to anothersubstrate or circuit.

The prior art heat spreader 100 thus requires two different metalforming processes to fabricate the hollow core stiffener 110 and theheat spreader plate 114. Assembly of the prior art heat spreader 100onto and around the semiconductor package 102 is a labor intensive,costly, and complicated process. It requires double adhesive dispensing(for the adhesive layers 112 and 116) and separate application andpositioning of the hollow core stiffener 110 and the heat spreader plate114. This results in a low units per hour (“UPH”) process.

Referring now to FIG. 2, therein is shown a heat spreader 200 accordingto the present invention. The heat spreader 200 is formed from a singlemetallic plate, preferably copper (Cu). As can be seen in FIG. 2, thecross-sectional profile of the heat spreader 200 in one dimension(horizontally transversely as depicted in FIG. 2) is constant and doesnot change in the horizontal direction perpendicular thereto, depictedby an arrow 202. This provides for highly efficient and inexpensivefabrication of the heat spreader, such as by continuous metal formingand/or extruding operations. A large number of such heat spreaders canthus be formed in a single metal stamping, continuous metal forming,and/or extruding operation from a single, unitary piece of metallicmaterial such as a metallic Cu sheet.

Heat spreaders, such as the heat spreader 200, that are thus formed in asingle metal stamping, continuous metal forming, and/or extrudingoperation (“unitary metal forming”) will have characteristic physicalproperties in the final product that are a result of such unitaryforming processes. Examples of such known physical characteristics fromunitary metal forming operations include: surface scoring, surfacehardness variations, bend stresses, inelastic deformations of the metal,and so forth. These physical characteristics can be easily determinedand observed by known and conventional analytical techniques. As aconsequence, heat spreaders according to the present invention that areformed in a single metal stamping and/or forming process will have thephysical characteristics of being formed in a unitary metal formingprocess.

The heat spreader 200, which is shown mounted on a substrate 204, isshaped to define a panel 206 that is raised above the substrate 204 todefine a channel 208 between the panel 206 and the substrate 204.Channel walls 210 depend from the panel 206, defining the sides of thechannel 208, to contact the substrate 204 on each side of the channel208. Optional through holes 212 in the channel walls 210 may be providedfor stress relief.

Extending laterally from the channel walls 210 are arched feet 214 forattaching and securing the heat spreader 200 to the substrate 204. Thearched feet 214, in this embodiment, terminate opposite the channel 208in reinforcing channels 216 that help to stiffen and reinforce thearched feet 214 to retain the shape thereof.

To secure the heat spreader 200 to the substrate 204, an adhesive 218,preferably a thermal adhesive, is located within and beneath the archedfeet 214, between the arched feet 214 and the substrate 204. Theadhesive 218 can be applied in discreet quantities, such as large-size“dots”, to achieve high UPH, or the adhesive may be applied through linedispensing for better thermal conductivity. As can be seen, the feet areformed in the arched shape to provide hollows beneath the arches of thefeet to accommodate respective volumes of the adhesive 218 therebeneath.The height of the arches is set in order to maintain a desired thicknessof the adhesive 218.

The heat spreader 200 includes one or more “external” reversing bendsoutside of and separate from the channel 208. These reversing bends areformed in the single metallic plate from which the heat spreader 200 isformed, and enable the features of the heat spreader to be integratedthereinto in such a unitary forming process on a single metallic plate.It also affords structural advantages such as increased strength andincreased bending resistance.

An example of an external reversing bend in the heat spreader 200 may beseen in the reinforcing channels 216. Thus, an upward trace starting atan inner wall 220 of either of the reinforcing channels 216 will passthrough a reversing bend 222 therein and continue in the reverse, ordownward, direction in an outer wall 224 of the reinforcing channel 216.That is, the trace continues in the reverse direction, opposite to theinitial trace direction.

Thus, the term “external reversing bend” will be seen and understood torefer to a reversing bend that is outside of and external to theportions of the heat spreader that immediately define the semiconductorreceiving channel, such as the channel 208, in a heat spreader accordingto the present invention,

The channel 208, defined by the channel walls 210 and the panel 206,forms a semiconductor receiving channel having a set height 226appropriate for receiving a semiconductor (not shown) therein. (But see,for example, FIG. 17, which shows such a semiconductor 102 in a likesemiconductor receiving channel.)

For connecting the semiconductor to external circuitry in known fashion,a conventional BGA 120 is disposed on the surface of the substrate 204opposite the heat spreader 200.

Referring now to FIG. 3, therein is depicted the application of theadhesive 218, by line dispensing, onto the substrate 204. The adhesive218 is dispensed in this manner prior to positioning the heat spreader200 thereon.

Referring now to FIG. 4, therein is shown a fragmentary end view of theheat spreader 200 of FIG. 2 following attachment thereof to thesubstrate 204 by the adhesive 218.

Referring now to FIG. 5, therein is shown an auxiliary heat spreader 500that is formed to fit over the heat spreader 200. The auxiliary heatspreader 500 forms an electromagnetic interference (“EMI”) shield (alsoknown as a Faraday cage). It also helps to increase the heat transfercapability and performance of the heat spreader 200.

The auxiliary heat spreader 500 is a unitary auxiliary heat spreaderthat is formed from an additional unitary metallic plate insubstantially a single metal forming process that configures it forattachment on top of the heat spreader 200. The auxiliary heat spreader500, the top surface of which can be used as a marking area, includesattachment means such as locking tabs 502 that are positioned thereon toengage underneath the arched feet 214 when the auxiliary heat spreader500 is positioned immediately on top of the heat spreader 200. When thuspositioned, the locking tabs 502 are pressed (deformed or bent) inwardlyand underneath the arched feet 214 to lock the auxiliary heat spreader500 in position on the heat spreader 200.

Referring now to FIG. 6, therein is shown a heat spreader 600 havingstand-off feet 602 attached to the substrate 204 by the adhesive 218.Similarly as the heat spreader 200 (FIG. 2), the heat spreader 600 isformed in a single metal stamping and forming process from a single,unitary piece of metallic material such as a metallic Cu sheet.

The heat spreader 600 provides a panel 604 supported by and above thestand-off feet 602 to define a channel 606 therebeneath and between thestand-off feet 602. The channel 606 is for receiving therewithin asemiconductor device, such as the semiconductor package 102 (not shown,but see FIG. 17), that is supported by and attached to the substrate204. The adhesive 218, as previously described (see FIG. 3) is appliedby line dispensing, although other application techniques, such as thedispensing of large-size dots, may be used as appropriate. Thedimensions of the stand-off feet 602 are set to maintain a desiredthickness of the adhesive 218.

The portions of the heat spreader 600 from the edges of the panel 604around and into the stand-off feet 602 will be seen to form externalreversing bends 608 in the heat spreader 600.

Referring now to FIG. 7, therein is shown a heat spreader 700 similar tothe heat spreader 600 (FIG. 6), except that the heat spreader 700 isprovided with toed feet 702. The toed feet 702 are attached to thesubstrate 204 by an adhesive 704 similar to the adhesive 218 (FIGS. 3and 6), except that the width of the line dispensing for the adhesive704 is narrower than that depicted in FIG. 3 for the adhesive 218. Thedimensions of the toed feet 702 are set to maintain a desired thicknessof the adhesive 704. The portions of the heat spreader 700 from theedges of the panel 604 around and into the toed feet 702 form externalreversing bends 706 in the heat spreader 700.

Referring now to FIG. 8, therein is shown a heat spreader 800 similar tothe heat spreaders 600 (FIG. 6) and 700 (FIG. 7), except that the heatspreader 800 has stand-off toed feet 802. The heat spreader 800 isattached to the substrate 204 by an adhesive 804 that is applied by linedispensing a single line of adhesive for each of the stand-off toed feet802. Then, when the heat spreader 800 is positioned onto the substrate204, each of the stand-off toed feet 802 presses into the adhesive 804,bisecting each of the line-dispensed adhesive strips as illustrated inFIG. 8, and securing the stand-off toed feet 802 to the substrate 204.The dimensions of the stand-off toed feet 802 are set to maintain adesired thickness of the adhesive 804.

It will also be seen that the portions of the heat spreader 800 externalto the channel 606, from the edges of the panel 604 around and into thestand-off toed feet 802, again form external reversing bends 806 in theheat spreader 800.

Referring now to FIG. 9, therein is shown a heat spreader 900 similar tothe heat spreaders illustrated in FIGS. 6-8, except that the heatspreader 900 has slotted flat feet 902. A slot 904 extending along andthrough the slotted flat foot 902 receives therein and therethrough anadhesive 906 (see also FIG. 10) to secure the heat spreader 900 to thesubstrate 204. The adhesive 906 may be applied to the substrate 204 byline dispensing, following which the slotted flat feet 902 are pressedinto the adhesive 906 to force the adhesive 906 into the slots 904 andsecure the heat spreader 900 onto the substrate 204. The dimensions ofthe slots 904 are set to maintain a desired quantity and extent of theadhesive 906.

The heat spreader 900 has external reversing bends 908 therein similarto the external reversing bends 706 (FIG. 7).

Referring now to FIG. 10, therein is shown a partial cross-sectionalview of the heat spreader 900 and the substrate 204 as illustrated inFIG. 9, taken through one of the slots 904.

Referring now to FIG. 1, therein is shown a heat spreader 1100 similarto the heat spreader 900 (FIG. 9) and similarly having slotted flat feet1102. However, the heat spreader 1100 has a depressed panel 1104 in thecenter thereof that defines a basin into which an auxiliary heatspreader 1106 can be received. The auxiliary heat spreader 1106 enhancesthe ability of the heat spreader 1100 to remove heat from semiconductordevices (not shown) located in the channel 606 between the depressedpanel 1104 and the substrate 204 therebeneath.

As before, the heat spreader 1100 has external reversing bends 1108therein, in this case similar to the external reversing bends 706 (FIG.7) and 908 (FIG. 9).

Referring now to FIG. 12, therein is shown a heat spreader 1200 havingslotted stand-off feet 1202. Similarly as the stand-off feet 602 (FIG.6), the slotted stand-off feet 1202 are spaced slightly apart from thesubstrate 204 to accommodate an adhesive (not shown) that attaches theheat spreader 1200 to the substrate 204. Each of the slotted stand-offfeet 1202 has a slot 1204 therethrough to receive adhesive and therebyenhance the adhesion of the heat spreader 1200 to the substrate 204. Theslots 1204 thus function in a similar manner to the slots 904 (FIGS. 9and 10).

The heat spreader 1200 has several types of reversing bends thereinexternal to the channel 208, such as upper and lower external reversingbends 1206 and 1208 located toward the edges of the heat spreader.

Referring now to FIG. 13, therein is shown a heat spreader 1300. Theheat spreader 1300 is formed from a single, unitary metallic plate likethe heat spreaders described above in FIGS. 2 and 6. Additionally, theheat spreader 1300 includes an integral auxiliary heat spreader 1302formed across the top thereof. Thus, the heat spreader 1300 includes aflat foot 1304 on one side, a flat foot 1306 on the opposite side, and araised panel 1308 supported and connected therebetween. A channel 1310is defined beneath the raised panel 1308 and above the substrate 204 onwhich the heat spreader 1300 is mounted and attached by the flat feet1304 and 1306. The integral auxiliary heat spreader 1302 is thus formedintegrally of the same unitary metallic plate that forms the raisedpanel 1308 and the rest of the heat spreader 1300, and is configured tobe located on top of the raised panel 1308.

To accommodate adhesive (not shown) and enhance the attachment of theheat spreader 1300 to the substrate 204, the flat foot 1306 is providedwith a slot 1312. The opposite flat foot 1304 contains a seam 1314therein defined by the opposite ends of the unitary metallic plate fromwhich the heat spreader 1300 was formed. The seam 1314 accommodatesadhesive for the flat foot 1304 similarly as the slot 1312 accommodatesadhesive for the flat foot 1306. The dimensions of the slot 1312 and theseam 1314 are set to maintain a desired quantity and extent of adhesive.

The portions of the heat spreader 1300 along the sides thereof thatconnect the integral auxiliary heat spreader 1302 to the flat feet 1304and 1306 form external reversing bends 1316 therein.

Referring now to FIG. 14, therein is shown a heat spreader 1400 havingstand-off feet 1402 with side ledges 1404 protruding away therefrom. Anauxiliary heat spreader 1406 has deformable sides 1408 that can be bentor deformed by pushing inwardly, when the auxiliary heat spreader 1406is positioned on top of the heat spreader 1400, to engage the sideledges 1404 and thus secure the auxiliary heat spreader 1406 on top ofthe heat spreader 1400.

Referring now to FIG. 15, therein is shown a heat spreader 1500 havingzigzag feet 1502. The zigzag feet 1502 are secured to the substrate 204by an adhesive (not shown) in a manner similar to the stand-off toedfeet 802 (FIG. 8). The dimensions of the zigzag feet 1502 are set tomaintain a desired quantity and extent of adhesive.

The heat spreader 1500 includes an auxiliary heat spreader 1504 that haslocking tabs 1506 formed on the sides 1508 of the auxiliary heatspreader 1504. The auxiliary heat spreader 1504 forms an EMI shield(Faraday cage), as well as helping to increase the heat transfercapability and performance of the heat spreader 1500.

To secure and lock the auxiliary heat spreader 1504 onto the heatspreader 1500, the auxiliary heat spreader 1504 is properly positionedon top of the heat spreader 1500. The locking tabs 1506 are then bent ordeformed into the channel 1510 beneath the panel 1512 of the heatspreader 1500.

The heat spreader 1500 also includes through holes 1514 in channel walls1516 depending from and connecting the panel 1512 to the zigzag feet1502. The through holes 1514 provide stress relief similarly as thethrough holes 212 (FIG. 2), and can assist with heat removal from thechannel 1510.

The heat spreader 1500 additionally includes several external reversingbends, such as the external reversing bends 1518 in the zigzag feet 1502and the external reversing bends 1520 in the reinforcing channels 216 ofthe heat spreader 1500.

Referring now to FIG. 16, therein is shown a heat spreader 1600 havingbox feet 1602 on each side thereof. The heat spreader 1600 has a panel1604 provided with through holes 1606 to assist heat removal therefrom.To augment heat removal even further from the heat spreader 1600, aclip-attach auxiliary heat spreader 1608 is also provided for the heatspreader 1600. The clip-attach auxiliary heat spreader 1608 includesside clips 1610 that are adapted to clip onto clip bosses 1612 that areformed along the upper edges of the box feet 1602. This provides forsnapping or clipping the clip-attach auxiliary heat spreader 1608 ontothe heat spreader 1600.

Referring now to FIG. 17, therein is shown a cross-sectional view, takengenerally on line 17-17 in FIG. 16, of the heat spreader 1600 and theclip-attach auxiliary heat spreader 1608 in their snapped orclipped-together configuration. The substrate 204 is shown with asemiconductor package 102 supported thereon beneath the panel 1604 ofthe heat spreader 1600. The channel 208 has a set height appropriate forreceiving such a semiconductor 102 therein and accommodating a thermalinterface material 1700 that is located between the semiconductorpackage 102 and the panel 1604, and in the through holes 1606. Thethermal interface material 1700, in known fashion, enhances heattransfer between the semiconductor package 102, the panel 1604, and theclip-attach auxiliary heat spreader 1608.

Referring now to FIG. 18, therein is shown a heat spreader 1800 having apanel 1802, the edges of which are formed into clip bosses 1804. Aclip-attach auxiliary heat spreader 1806, formed from a single, unitarypiece or plate of metallic material such as a metallic Cu sheet, hascenter clips 1808 formed therein to compliment the clip bosses 1804. Thecenter clips 1808 are then clipped onto the clip bosses 1804 to attachthe clip-attach auxiliary heat spreader 1806 onto the heat spreader 1800to augment the heat spreading capability thereof.

Referring now to FIG. 19, therein is shown a heat spreader 1900 formedfrom a single plate of metallic material. The heat spreader 1900 has apanel 1902 that is flanked by pairs of box feet 1904. A grip-attachauxiliary heat spreader 1906, also formed from a single plate ofmetallic material, is designed and dimensioned to attach to the heatspreader 1900 by gripping the panel 1902 at the sides thereof. Moreparticularly, the grip-attach auxiliary heat spreader 1906 has side arms1908 formed and extending downwardly thereon that are separated by adistance just slightly less than the corresponding width of the panel1902. This provides for a tight friction fit of the side arms 1908 ontothe panel 1902 when pressed or positioned thereon.

A conventional BGA 120 is disposed on the surface of the substrate 204opposite the heat spreader 1900.

Referring now to FIG. 20, therein is shown a top view of the heatspreader 1400 (FIG. 14).

Referring now to FIG. 21, therein is shown a top view of a heat spreader2100 similar to the heat spreader 1400 as illustrated in FIG. 20, butincluding notches 2102 on the ends of the panel 2104 thereof. Thenotches 2102 provide for ventilation or for interlocking with anauxiliary heat spreader such as the auxiliary heat spreader 2800 (FIG.28).

Referring now to FIG. 22, therein is shown a top view of a heat spreader2200 similar to the heat spreader 2100 as illustrated in FIG. 21, butincluding slots 2202 formed in the side ledges 2204 thereof. The slots2202 provide for additional ventilation or additional interlocking withan auxiliary heat spreader. The notches 2102 and slots 2202 can bereadily formed using conventional manufacturing processes such as, forexample, blanking and/or bending.

Referring now to FIG. 23, therein is shown a top view of a heat spreader2300 having a circular rather than linear configuration for thestand-off feet. As described in greater detail in connection with FIGS.24, 26, and 27, the heat spreader 2300 has a cross-sectional profilesimilar to that of the heat spreader 1400 (FIGS. 14 and 20), and thusprovides similar features and functionality. In additional, since thesemiconductor package channel (see 208′ in FIG. 27) is circularlyclosed, it forms an excellent one-piece, low-cost EMI shield. The heatspreader 2300 can be readily formed using conventional manufacturingprocesses such as, for example, stamping, coining, milling, molding,and/or etching.

Referring now to FIG. 24, therein is shown a top view of a heat spreader2400 similar to the heat spreader 2300 as illustrated in FIG. 23, butincluding notches 2102′ formed therein similar to the notches 2102 inthe heat spreader 2100 (FIG. 21).

Referring now to FIG. 25, therein is shown a top view of a heat spreader2500 similar to the heat spreader 2400 as illustrated in FIG. 24, butincluding slots 2202′ formed therein similar to the slots 2202 in theheat spreader 2200 (FIG. 22).

Referring now to FIG. 26, therein is shown an enlarged top view of theheat spreader 2400 shown in FIG. 24. Although having a circularconfiguration, the heat spreader 2400 has a cross-sectional profile andfunctional features similar to that of the heat spreader 1400 (FIG. 14),as can be seen in FIG. 27. Features and elements analogous to those inFIG. 14 therefore have the same reference numbers primed, and will beunderstood to be similarly described by reference to their unprimedcounterparts (FIG. 14).

Also shown in FIG. 26 is an arc-dispensed adhesive 2600, dispensed intothe space beneath the stand-off foot 1402′.

Referring now to FIG. 27, therein is shown a cross-sectional view of theheat spreader 2400 shown in FIG. 26, taken on line 27-27 therein. As canbe seen herein, the stand-off foot 1402′ has a set height to accommodatethe arc-dispensed adhesive 2600.

Referring now to FIG. 28, therein is shown an isometric view of the heatspreader 2400 shown in FIGS. 26 and 27. Also shown is an auxiliary heatspreader 2800 that has tabs 2802 that are dimensioned to match andmechanically interlock with the notches 2102′ when the auxiliary heatspreader 2800 is positioned on top of the heat spreader 2400. When thuspositioned, the tabs 2802 may be bent inwardly to secure the auxiliaryheat spreader 2800 on top of the heat spreader 2400.

It will be understood, of course, that similar circular patternadaptations of other linear configurations, as disclosed above, may alsobe made as desired or appropriate.

Referring now to FIG. 29, therein is shown a flow chart of a method 2900for fabricating a semiconductor heat spreader in accordance with thepresent invention. The method 2900 includes providing a unitary metallicplate in a block 2902; and, in a block 2904; forming the unitarymetallic plate into a panel, channel walls depending from the panel todefine a channel between the channel walls and the panel for receiving asemiconductor therein; at least two feet extending from respectivechannel walls for attachment to a substrate, and at least one externalreversing bend.

Thus, it has been discovered that the heat spreaders and thesemiconductor heat spreader fabrication methods of the present inventionfurnish important and heretofore unavailable solutions, capabilities,and functional advantages for meeting the needs for heat management andheat dissipation in semiconductor packages.

One important advantage is that the heat spreaders are formed from andas a single metallic plate, in a single metal stamping and formingprocess. This is a significant improvement over prior heat spreadersthat required formation and assembly of multiple components, sometimesinvolving significant machining operations.

Another advantage of the present invention is provided by the symmetry,along one axis, that enables the heat spreaders to be formed incontinuous shaping and/or extruding operations.

Still another advantage is the great versatility in configurations andshapes that is made possible by the present invention.

Another advantage is that the heat spreaders are highly versatile andcustomizable according to particular needs and applications.

Still another advantage of the present invention is the economy andefficiency with which the optional auxiliary heat spreaders can befabricated, also in a single metal stamping and forming process, from asingle, unitary piece or plate of metallic material. The auxiliary heatspreaders themselves are highly versatile: they can serve, for example,as just a top cover, as an EMI shield, or as an active part of the heatspreader itself. In either case, not only are the auxiliary heatspreaders easily and inexpensively fabricated, but they can be just asreadily and inexpensively attached onto the heat spreaders. Theattachment of the auxiliary heat spreaders, such as by the several taband/or snap configurations disclosed herein, is particularly efficient,effective, and economical.

Another advantage of the present invention is that the thermal adhesivecan be efficiently and very effectively applied through fast,inexpensive line dispensing. This not only affords an economical, highlyreliable, and effective bond of the heat spreader to the substrate, butit also affords enhanced thermal conductivity in the interface betweenthe heat spreader and the substrate.

Still another advantage of the present invention is that the thermal andbonding interface between the heat spreader and the substrate mayalternatively be provided by dispensing the thermal adhesive inlarge-size dots, thereby providing higher UPH.

The resulting processes and configurations are thus straightforward,economical, uncomplicated, highly versatile and effective, use existingtechnologies, and are thus readily suited for economically andeffectively manufacturing semiconductor heat spreader devices usingconventional manufacturing processes and technologies. The presentinvention thus takes heat spreader technology to the next level.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations which fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. A method for fabricating a semiconductor heat spreader, comprising: providing a unitary metallic plate; and forming the unitary metallic plate into: a panel; channel walls depending from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein; at least two feet extending from respective channel walls for attachment to a substrate; and at least one external reversing bend.
 2. The method of claim 1 wherein the feet are selected from an arched foot, a stand-off foot, a slotted stand-off foot, a toed foot, a stand-off toed foot, a flat foot, a slotted flat foot, a zigzag foot, a box foot, and a combination thereof.
 3. The method of claim 1 further comprising forming the feet to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate.
 4. The method of claim 1 further comprising forming an electromagnetic interference shield for the channel.
 5. The method of claim 1 further comprising: providing an additional unitary metallic plate; and forming the additional unitary metallic plate into a unitary auxiliary heat spreader configured for attachment on top of the semiconductor heat spreader.
 6. The method of claim 5 further comprising forming attachment means for attaching the unitary auxiliary heat spreader to the semiconductor heat spreader, the attachment means being selected from tabs, locking tabs, deformable sides, side ledges, side clips, clip bosses, center clips, side arms, and a combination thereof.
 7. The method of claim 1 wherein forming the unitary metallic plate further comprises forming the unitary metallic plate in substantially a single metal forming process to also form an integral auxiliary heat spreader located on top of the panel.
 8. The method of claim 1 wherein forming the unitary metallic plate further comprises forming the unitary metallic plate in substantially a single metal forming process into a cross-sectional profile that is substantially constant in at least one horizontal direction.
 9. A method for fabricating a semiconductor heat spreader, comprising: providing a unitary metallic plate; forming the unitary metallic plate in substantially a single metal forming process into: a panel; channel walls depending from opposite sides of the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein; at least two feet extending from respective channel walls on opposite sides of the panel for attachment to a substrate, the feet being: selected from an arched foot, a stand-off foot, a slotted stand-off foot, a toed foot, a stand-off toed foot, a flat foot, a slotted flat foot, a zigzag foot, a box foot, and a combination thereof; and formed to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate; a cross-sectional profile that is substantially constant in at least one horizontal direction; and at least one external reversing bend.
 10. The method of claim 9 further comprising: providing an additional unitary metallic plate; forming the additional unitary metallic plate in substantially a single metal forming process into a unitary auxiliary heat spreader configured for attachment on top of the semiconductor heat spreader; and forming attachment means for attaching the unitary auxiliary heat spreader to the semiconductor heat spreader, the attachment means being selected from tabs, locking tabs, deformable sides, side ledges, side clips, clip bosses, center clips, side arms, and a combination thereof.
 11. A semiconductor heat spreader comprising a unitary metallic plate having: a panel; channel walls depending from the panel to define a semiconductor receiving channel between the channel walls and the panel; at least two feet extending from respective channel walls for attachment to a substrate; and at least one external reversing bend.
 12. The semiconductor heat spreader of claim 11 wherein the feet are selected from an arched foot, a stand-off foot, a slotted stand-off foot, a toed foot, a stand-off toed foot, a flat foot, a slotted flat foot, a zigzag foot, a box foot, and a combination thereof.
 13. The semiconductor heat spreader of claim 11 wherein the feet are formed to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate.
 14. The semiconductor heat spreader of claim 11 further comprising an electromagnetic interference shield for the channel.
 15. The semiconductor heat spreader of claim 11 further comprising an additional unitary metallic plate configured as a unitary auxiliary heat spreader for attachment on top of the semiconductor heat spreader.
 16. The semiconductor heat spreader of claim 15 further comprising attachment means for attaching the unitary auxiliary heat spreader to the semiconductor heat spreader, the attachment means being selected from tabs, locking tabs, deformable sides, side ledges, side clips, clip bosses, center clips, side arms, and a combination thereof.
 17. The semiconductor heat spreader of claim 11 further comprising an integral auxiliary heat spreader formed from the unitary metallic plate, located on top of the panel, and having the physical characteristics of being formed in a unitary metal forming process.
 18. The semiconductor heat spreader of claim 11 wherein the unitary metallic plate has the physical characteristics of being formed in a unitary metal forming process and a cross-sectional profile that is substantially constant in at least one horizontal direction.
 19. A semiconductor heat spreader comprising a unitary metallic plate having: a panel; channel walls depending from opposite sides of the panel to define a semiconductor receiving channel between the channel walls and the panel; at least two feet extending from respective channel walls on opposite sides of the panel for attachment to a substrate, the feet being: selected from an arched foot, a stand-off foot, a slotted stand-off foot, a toed foot, a stand-off toed foot, a flat foot, a slotted flat foot, a zigzag foot, a box foot, and a combination thereof; and formed to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate; a cross-sectional profile that is substantially constant in at least one horizontal direction; the physical characteristics of being formed in a unitary metal forming process; and at least one external reversing bend.
 20. The semiconductor heat spreader of claim 19 further comprising: an additional unitary metallic plate configured as a unitary auxiliary heat spreader for attachment on top of the semiconductor heat spreader and having the physical characteristics of being formed in a unitary metal forming process; and attachment means for attaching the unitary auxiliary heat spreader to the semiconductor heat spreader, the attachment means being selected from tabs, locking tabs, deformable sides, side ledges, side clips, clip bosses, center clips, side arms, and a combination thereof. 